| Silver
Conductor Pastes |
| Green
Products are Lead-Free, Cadmium-Free |
Order
Trial Quantity |
| Product |
Purpose |
PDF |
 |
| 599-G |
Low temperature firing silver, for use on glass, for example for touch screens |
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 |
| 903-A
|
Silver, for use as a top or inner-layer metallization in co-fired LTCC, on other tape systems, and with 4604-A/4605 on aluminum |
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|
| 903-B
|
Silver, for use as an inner-layer or ground-plane metallization in co-fired LTCC and other tape systems |
|
|
| 903-C
|
Silver, for use as a solderable top-layer metallization with low dielectric constant co-fired ceramic tape systems. ESL 903-C is
designed for use as a post-fired conductor. |
|
|
| 903-D
|
Silver, for use as a solderable top-layer metallization to be post fired on LTCC and other tape systems |
|
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| 9907 |
Pure silver, for use as an interconnect paste in SOFC and other fuel cells |
|
|
| 9912-G |
Excellent solderability and leach resistance, for use
on alumina or beryllia |
|
|
| 9912-K |
Excellent solderability and adhesion, co-fires with resistors, also can be used with 4603/4604 dielectrics on aluminum |
|
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| 9912-K FL |
Fine-line printing, for use on glass, PES, alumina, and special ceramics |
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|
| 9913 |
Excellent
conductor for aluminum nitride substrates |
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|
| 9925-G |
Back-side Ag paste, aluminum-doped, for use on silicon solar cells |
|
|
590
|
For
use on glass, PES and ceramic substrates, fires at 500-700 °C |
|
|
| 590-G |
For
use on glass, PES and ceramic substrates, fires at 450-580 °C |
|
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| 599-E |
For
use on touch screens, low-temperature 450 °C firing |
|
|
| 902 |
Silver Via Fill, for use in co-fired LTCC systems |
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| 9910-C |
For use on low temperature firing substrates including PZT and glass |
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|
| 9912 |
General
purpose, for use on PES, alumina or beryllia |
|
|
| 9912-A |
Excellent solderability, leach resistance, for use on alumina, beryllia, or dielectric on stainless steel |
|
|
| 9912-F |
Resistivity
<2 mohm/sq., for use in microwave applications |
|
|
| 9912-THP |
Through-hole
applications in alumina substrates |
|
|
| 9916 |
Electrode
for use with 4150 and 4200-C Series capacitor dielectrics |
|
|
| 9925 |
Back-side Ag paste, aluminum-doped, Cd-free and low lead, for use on silicon solar cells |
|
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| 9926 |
Pure silver paste, Cd-free and low lead, for use on silicon solar cells |
|
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| 9987 |
Front-side silver contact paste, Cd-free with low lead content, for use on crystalline or polycrystalline silicon solar cells |
|
|
| 9990 |
Excellent
adhesion, solder wetting and leach resistance, fritless |
|
|
| 9996-B |
For
use on PES, excellent adhesion and solderability |
|
|
|
The
above pastes are selected from the full ESL range and
are representative of the most common market requirements.
If you are seeking properties or characteristics not
shown above, please contact ESL.
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