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Ceramic Tapes
(See Ceramic Tape Systems)

Silver Conductor Pastes
Silver/Platinum
Conductor Pastes

Silver/Palladium Conductor Pastes
Silver/Palladium/Platinum Conductor Pastes
Platinum Conductor Pastes
Platinum/Gold
Conductor Pastes

Gold Conductor Pastes
Specialty Conductor Pastes
Polymer Pastes
Crossover/Multilayer
Dielectrics & Dielectric
Coatings


Capacitor Dielectric Pastes
Resistor Pastes
Overglaze & Sealing Dielectric Pastes

Vehicles & Thinners

Porous Cover Plates

Solder Pastes
(from ESL Europe Only)

Silver Conductor Pastes
Green Products are Lead-Free, Cadmium-Free Order Trial Quantity
Product Purpose PDF
599-G Low temperature firing silver, for use on glass, for example for touch screens
903-A Silver, for use as a top or inner-layer metallization in co-fired LTCC, on other tape systems, and with 4604-A/4605 on aluminum
903-B Silver, for use as an inner-layer or ground-plane metallization in co-fired LTCC and other tape systems
903-C Silver, for use as a solderable top-layer metallization with low dielectric constant co-fired ceramic tape systems. ESL 903-C is designed for use as a post-fired conductor.
903-D Silver, for use as a solderable top-layer metallization to be post fired on LTCC and other tape systems
9907 Pure silver, for use as an interconnect paste in SOFC and other fuel cells
9912-G Excellent solderability and leach resistance, for use on alumina or beryllia
9912-K Excellent solderability and adhesion, co-fires with resistors, also can be used with 4603/4604 dielectrics on aluminum
9912-K FL Fine-line printing, for use on glass, PES, alumina, and special ceramics
9913 Excellent conductor for aluminum nitride substrates
9925-G Back-side Ag paste, aluminum-doped, for use on silicon solar cells
590
For use on glass, PES and ceramic substrates, fires at 500-700 °C
590-G For use on glass, PES and ceramic substrates, fires at 450-580 °C
599-E For use on touch screens, low-temperature 450 °C firing
902 Silver Via Fill, for use in co-fired LTCC systems
9910-C For use on low temperature firing substrates including PZT and glass
9912 General purpose, for use on PES, alumina or beryllia
9912-A Excellent solderability, leach resistance, for use on alumina, beryllia, or dielectric on stainless steel
9912-F Resistivity <2 mohm/sq., for use in microwave applications
9912-THP Through-hole applications in alumina substrates
9916 Electrode for use with 4150 and 4200-C Series capacitor dielectrics
9925 Back-side Ag paste, aluminum-doped, Cd-free and low lead, for use on silicon solar cells
9926 Pure silver paste, Cd-free and low lead, for use on silicon solar cells
9987 Front-side silver contact paste, Cd-free with low lead content, for use on crystalline or polycrystalline silicon solar cells
9990 Excellent adhesion, solder wetting and leach resistance, fritless
9996-B For use on PES, excellent adhesion and solderability

The above pastes are selected from the full ESL range and are representative of the most common market requirements. If you are seeking properties or characteristics not shown above, please contact ESL.

ESL ElectroScience • 416 East Church Rd. • King of Prussia, PA • 19406-2625 • USA • Tel: 610-272-8000 • Fax: 610-272-6759
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