ElectroScience - Thick-Film Materials & Ceramic TapesElectroScience - Thick-Film Materials & Ceramic Tapes

Products

Silver Conductor Pastes

Product Purpose PDF Order Trial
Quantity
599-G Low temperature firing silver, for use on glass, for example for touch screens
903-A Silver, for use as a top or inner-layer metallization in co-fired LTCC, on other tape systems, and with 4604-A/4605 on aluminum
903-B Silver, for use as an inner-layer or ground-plane metallization in co-fired LTCC and other tape systems
903-C Silver, for use as a solderable top-layer metallization with low dielectric constant co-fired ceramic tape systems. ESL 903-C is designed for use as a post-fired conductor.
903-D Silver, for use as a solderable top-layer metallization to be post fired on LTCC and other tape systems
9907 Pure silver, for use as an interconnect paste in SOFC and other fuel cells
9912-G Excellent solderability and leach resistance, for use on alumina or beryllia
9912-K Excellent solderability and adhesion, co-fires with resistors, also can be used with 4603/4604 dielectrics on aluminum
9912-K FL Fine-line printing, for use on glass, PES, alumina, and special ceramics
9912-K THICK PRINT A very smooth, screen-printable silver conductor for use in power and heat spreading applications
9913 Excellent conductor for aluminum nitride substrates
9927-G Lead-free cadmium-free back-side pure silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon
9927-GH Lead-free cadmium-free back-side pure silver paste with the highest adhesion, and with excellent efficiency and coverage, for use on monocrystalline or polycrystalline silicon
9928-G Lead-free cadmium-free back-side aluminum-doped silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon
590
For use on glass, PES and ceramic substrates, fires at 500-700 °C
590-G For use on glass, PES and ceramic substrates, fires at 450-580 °C
599-E For use on touch screens, low-temperature 450 °C firing
902 Silver Via Fill, for use in co-fired LTCC systems
9910-C For use on low temperature firing substrates including PZT and glass
9912 General purpose, for use on PES, alumina or beryllia
9912-A Excellent solderability, leach resistance, for use on alumina, beryllia, or dielectric on stainless steel
9912-F Resistivity <2 mohm/sq., for use in microwave applications
9912-THP Through-hole applications in alumina substrates
9916 Electrode for use with 4150 and 4200-C Series capacitor dielectrics
9921 Low-lead cadmium-free back-side aluminum-doped silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon
9924 Low-lead cadmium-free back-side pure silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon
9990 Excellent adhesion, solder wetting and leach resistance, fritless
9996-B For use on PES, excellent adhesion and solderability
Green Products are Lead-Free, Cadmium-Free

The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)