Products
Silver Conductor Pastes
| Product | Purpose | Order Trial Quantity |
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|---|---|---|---|
| 599-G | Low temperature firing silver, for use on glass, for example for touch screens |  |
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| 903-A | Silver, for use as a top or inner-layer metallization in co-fired LTCC, on other tape systems, and with 4604-A/4605 on aluminum | |
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| 903-B | Silver, for use as an inner-layer or ground-plane metallization in co-fired LTCC and other tape systems | |
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| 903-C | Silver, for use as a solderable top-layer metallization with low dielectric constant co-fired ceramic tape systems. ESL 903-C is designed for use as a post-fired conductor. | |
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| 903-D | Silver, for use as a solderable top-layer metallization to be post fired on LTCC and other tape systems | |
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| 9907 | Pure silver, for use as an interconnect paste in SOFC and other fuel cells | |
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| 9912-G | Excellent solderability and leach resistance, for use on alumina or beryllia | |
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| 9912-K | Excellent solderability and adhesion, co-fires with resistors, also can be used with 4603/4604 dielectrics on aluminum | |
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| 9912-K FL | Fine-line printing, for use on glass, PES, alumina, and special ceramics | |
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| 9912-K THICK PRINT | A very smooth, screen-printable silver conductor for use in power and heat spreading applications | |
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| 9913 | Excellent conductor for aluminum nitride substrates | |
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| 9927-G | Lead-free cadmium-free back-side pure silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon | |
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| 9927-GH | Lead-free cadmium-free back-side pure silver paste with the highest adhesion, and with excellent efficiency and coverage, for use on monocrystalline or polycrystalline silicon | |
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| 9928-G | Lead-free cadmium-free back-side aluminum-doped silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon | |
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| 590 |
For use on glass, PES and ceramic substrates, fires at 500-700 °C | |
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| 590-G | For use on glass, PES and ceramic substrates, fires at 450-580 °C | |
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| 599-E | For use on touch screens, low-temperature 450 °C firing | |
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| 902 | Silver Via Fill, for use in co-fired LTCC systems | |
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| 9910-C | For use on low temperature firing substrates including PZT and glass | |
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| 9912 | General purpose, for use on PES, alumina or beryllia | |
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| 9912-A | Excellent solderability, leach resistance, for use on alumina, beryllia, or dielectric on stainless steel | |
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| 9912-F | Resistivity <2 mohm/sq., for use in microwave applications | |
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| 9912-THP | Through-hole applications in alumina substrates | |
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| 9916 | Electrode for use with 4150 and 4200-C Series capacitor dielectrics | |
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| 9921 | Low-lead cadmium-free back-side aluminum-doped silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon | |
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| 9924 | Low-lead cadmium-free back-side pure silver paste with the highest efficiency and coverage, for use on monocrystalline or polycrystalline silicon | |
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| 9990 | Excellent adhesion, solder wetting and leach resistance, fritless | |
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| 9996-B | For use on PES, excellent adhesion and solderability | |
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Green Products are Lead-Free, Cadmium-Free
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)