A Selection of ESL ElectroScience Technical Publications:

	Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technology - IMAPS, Germany, 2008 (375kB)
	Manufacture of LSM and GDC Thick Film Pastes for SOFCs in ISO 9001 Environment - SOFC-X, Nara, Japan, 2007 (150kB)
	Manufacturability of very thin Zirconia Tapes in an ISO 9001 Environment - IMAPS 2005, Philadelphia (712kB)
	Lead-Free, Zero-Shrink, Substrate-Bonded LTCC System - IMAPS 2003, Boston (776kB)
	Materials for Capacitive and Inductive Components with Commercially Available LTCC Systems – IMAPS 2003, Israel (132kB)
	Lead-Free Dielectric and Magnetic Materials for Integrated Passives - ECS 2003, Orlando (1.95MB)
	Compliant Dielectric and Magnetic Materials for Buried Components – IMAPS 2002, Denver (208kB)
	Low-Profile LTCC Transformers – IMAPS 2002, Denver (122kB)
	Lead-Free Multilayer Dielectric System for Telecommunications – ACerS 2001, Indianapolis (209kB)
	Realisation of RF Band-Pass Filters in an LTCC Module Structure – IMAPS 2000, Europe (93kB)
	Ceramic Tapes for Wireless Applications – ACerS 2000, St Louis (68kB)
	Low-K, Low-Loss, Low-Fire Tape System for Microwave Application – IMAPS 2000, Israel (106kB)
	New Microwave Applications for Thick-Film Thermistors – IMAPS 1998, San Diego (145kB)
	Thick-Film Temperature Variable Attenuators – ISHM 1997, Philadelphia (1.5MB)
	ESD Susceptibility of High Gauge Factor Thick-Film Piezoresistors – ISHM 1996, Minneapolis (45kB)
	Thick-Film Heaters made from Dielectric Tape-Bonded Stainless-Steel Substrates – ISHM 1995, Los Angeles (1.2MB)
	New Capacitor Dielectric Covering K=2,000 to 12,000 for Printing and Firing Application Below 1,000°C – ISHM 1992, San Francisco (296kB)