Products
Ceramic Tape Systems
| Tape | 41010 | 41110 | 41020 | 41050 | 41060 |
| Tape Type | LTCC | LTCC | LTCC | LTCC | LTCC |
| Primary Characteristic | Intermediate k | Low k | Intermediate k | Higher k | Higher k |
| Lead-free? | no | yes | yes | yes | yes |
| Firing Temperature | 875 °C | 850 °C | 875 °C | 875 °C | 875 °C |
| Dielectric Constant | 7.3 | 4.2 | 7.4 | 13 | 16 |
| Shrinkage, XY% | 13+/-0.5 | 13+/-0.5 | 13+/-0.5 | 9.5+/-1.0 | 9.5+/-1.0 |
| Shrinkage, Z% | 17+/-1.0 | 16+/-1.0 | 17+/-1.0 | 15+/-1.0 | 15+/-1.0 |
| Fired Density (g/ml) | 3.2 | 2.3 | 3.2 | 3.2 | 3.5 |
| TCE ppm | 7 | 6.4 | 7.4 | 7.15 | 7.55 |
| Thermal Conductivity (W/(m.K) | 3 | 3 | 3 | - | - |
| Loss @ 3 GHz (dB/mm) | 0.0057 | 0.0037 | 0.0047 | - | - |
| Loss @ 10 GHz(dB/mm) | 0.0183 | 0.0099 | 0.0106 | - | - |
| Top Silver | 903-A | 903-A | 903-A | 903-A | 903-A |
| Groundplane Silver | 903-B | 903-B | 903-B | 903-B | 903-B |
| Internal Silver | 903-A | 903-A | 903-A | 903-A | 903-A |
| Solderable Silver | 903-D | 903-C | 903-D | 903-D | 903-D |
| Via Fill | 902 | 902 | 902 | 902 | 902 |
| Wirebondable Gold | 803 | 803 | 803 | 803 | 803 |
| Top Silver (Ag/Pt) | 953 | 953 | 953 | 953 | 953 |
| Top Silver (Ag/Pd) | 963 | 963 | 963 | 963 | 963 |
| ESL Low Temperature Transfer Tape (LTTT) Systems | |||||
| Tape | 41010-T | 41110-T | 41020-T | 41030-T | 41030-T-200 |
| Tape Type | LTTT | LTTT | LTTT | LTTT | LTTT |
| Primary Characteristic | Intermediate k | Low k | Intermediate k | 430 S/S | 430 S/S |
| Lead-free? | no | yes | yes | yes | yes |
| Firing Temperature | 850 °C | 850 °C | 850 °C | 850 °C | 850 °C |
| Dielectric Constant | 7.3 | 4.2 | 7.4 | 9.5 | 9.5 |
| Shrinkage, XY% | 0 | 0 | 0 | 0 | 0 |
| Shrinkage, Z% | 50+/-5.0 | 50+/-5.0 | 50+/-5.0 | 50+/-5.0 | 50+/-5.0 |
| Fired Density (g/ml) | 3.1 | 2.3 | 3.1 | 2.8 | 2.8 |
| Loss @ 3 GHz (dB/mm) | ~0.006 | ~0.004 | ~0.005 | (thickness = 125 µm) | (thickness = 200 µm) |
| Note that standard ESL metallizations recommended for use on alumina, such as 9912-G, can also be used on ESL LTTT Systems. | |||||
| ESL Specialty Tape Systems | ||||||
| Tape | 40010 | 40011 | 40012 | 42000 | 42013-A | 44000 |
| Tape Type | LTCC | LTCC | LTCC | HTCC | HTCC | HTCC |
| Primary Characteristic | Ferrite (Magnetic) |
Ferrite (Magnetic) |
Ferrite (Magnetic) |
Zirconia (3 mol% YSZ) |
Zirconia (5 mol% YSZ) |
Alumina (96%) |
| Lead-free? | yes | yes | yes | yes | yes | no |
| Firing Temperature | 885 °C | 885 °C | 885 °C | 1450 °C | 1500 °C | 1450 °C |
| Permeability | 50 | 200 | 500 | - | - | - |
| Shrinkage, XY% | 17+/-1 | 17+/-1 | 17+/-1 | 22+/-1 | 17.8+/-1 | 17.5+/-1 |
| Shrinkage, Z% | 14+/-1 | 16.5+/-1 | 16.5+/-1 | 22+/-1 | 17.8+/-1 | 16.5+/-1 |
| Fired Density (g/ml) | 5.3 | 5.3 | 5.3 | 5.5 | 5.5 | 3.7 |
| TCE ppm | 9.4 | 9.4 | 9.4 | - | - | - |
| Top Ag or Pt | 903-A | 903-A | 903-A | 5542 | go to Sensors | 5542 |
| Internal Silver | 903-B | 903-B | 903-B | - | - | - |
| Via Fill | 902 | 902 | 902 | - | - | - |
| Top Silver (Ag/Pt) | 953 | 953 | 953 | - | - | - |
| Top Silver (Ag/Pd) | 963 | 963 | 963 | - | - | - |
| ESL Ceramic Tape Systems for SOFC | |
| YSZ Electrolyte Tape (~20µm) | 42400 |
| YSZ Electrolyte Tape (~125µm) | 42401 |
| NiO/YSZ Anode Tape | 42420 |
| Porous NiO/YSZ Anode Tape | 42421 |
| YSZ Electrolyte Paste | 4481 |
| GDC Electrolyte Paste | 4343 |
| Nickel Oxide Anode Paste | 4410 |
| Nickel Oxide Anode Paste with added Pore-Former | 4411 |
| Nickel Oxide (50 wt%)/Zirconia (50 wt%) Anode Paste | 4412 |
| Nickel Oxide (65 wt%)/Zirconia (35 wt%) Anode Paste | 4416 |
| LSM Cathode Paste | 4420 |
| LSCF Cathode Paste | 4421 |
| LSM/Zirconia Cathode Paste | 4422 |
| LCC Interconnect Paste | 4480 |
| LSCC Interconnect Paste | 4482 |
| Pt Interconnect Paste | 5542 |
| Ag Interconnect Paste | 9906 |
| Ag-Pd Interconnect Paste | 9627 |
| Ag-Pt Interconnect Paste | 9512-G |
| Au Interconnect Paste | 8884-G |
| Porosity-Forming Paste | 4441 |
| Brazing Paste | 2323 |
Green Products are Lead-Free, Cadmium-Free
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)